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TSV632, TSV633, TSV634, TSV635
Rail-to-rail input/output 60 A 880 kHz operational amplifiers
Features

Rail-to-rail input and output Low power consumption: 60 A typ at 5 V Low supply voltage: 1.5 V - 5.5 V Gain bandwidth product: 880 kHz typ Unity gain stability Low power shutdown mode: 5 nA typ Low offset voltage: 800 V max (A version) Low input bias current: 1 pA typ EMI hardened op-amps High tolerance to ESD: 4 kV HBM Extended temperature range: -40 C to +125 C SO-8 SOT23-8
MiniSO-8
Applications

Battery-powered applications Portable devices Signal conditioning Active filtering Medical instrumentation TSSOP-14
Description
The TSV63x series of dual and quad operational amplifiers offers low voltage operation and rail-torail input and output. This family features an excellent speed/power consumption ratio, offering a 880 kHz gainbandwidth product while consuming only 60 A at 5 V supply voltage. The devices also feature an ultra-low input bias current and have a shutdown mode (TSV633, TSV635). These features make the TSV63x family ideal for sensor interfaces, battery-supplied and portable applications, as well as active filtering. TSSOP-16
June 2009
Doc ID 15688 Rev 2
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Contents
TSV63x
Contents
1 2 3 4 Package pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 Operating voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Rail-to-rail input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Rail-to-rail output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Shutdown function (TSV633 - TSV635) . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Optimization of DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Driving resistive and capacitive loads . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 PCB layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Macromodel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.1 5.2 5.3 5.4 5.5 5.6 SOT23-8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SO-8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 MiniSO-8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 MiniSO-10 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 TSSOP14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 TSSOP16 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6 7
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
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TSV63x
Package pin connections
1
Package pin connections
Figure 1. Pin connections for each package (top view)
Out1
Out1 In1In1+ VCC1 2 3 4 _ + _ + 8 7 6 5 VCC+ Out2 In2In2+
1 2 3 4 5 _ + _ +
10 VCC+ 9 8 7 6 Out2 In2In2+ SHDN2
In1In1+ VCCSHDN1
TSV632IDT/IST/ILT SO8/Mini-SO8/SOT23-8
1 2 3 4 5 6 7 8
TSV633IST MiniSO-10
16 Out4 _ + _ + 15 In414 In4+ 13 VCC+ _ + _ 12 In3+ 11 In310 Out3 9 SHDN3/4
Out1
Out1 In1In1+ VCC+ In2+ In2Out2
1 2 3 4 5 6 7 + _ + _ _ + _ +
14 Out4 13 In412 In4+ 11 VCC10 In3+
In1In1+ VCC+ In2+ In2-
9 8
In3Out2
Out3
SHDN1/2
TSV634IPT TSSOP14
TSV635IPT TSSOP16
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Absolute maximum ratings and operating conditions
TSV63x
2
Absolute maximum ratings and operating conditions
Table 1.
Symbol VCC Vid Vin Iin SHDN Tstg Supply voltage
(1) (2)
Absolute maximum ratings (AMR)
Parameter Value 6 VCC VCC- - 0.2 to VCC++ 0.2 10
(3)
Unit V V V mA V C
Differential input voltage Input voltage Input current
(3) (4)
Shutdown voltage
VCC- - 0.2 to VCC++ 0.2 -65 to +150 ambient(5)(6) 105 190 125 113 100 95 150 4 300 1.5 200
Storage temperature Thermal resistance junction to SOT23-8 MiniSO-8 SO-8 MiniSO-10 TSSOP14 TSSOP16 model(7) model(9)
Rthja
C/W
Tj ESD
Maximum junction temperature HBM: human body MM: machine model(8)
C kV V kV mA
CDM: charged device Latch-up immunity
1. All voltage values, except differential voltage are with respect to network ground terminal. 2. Differential voltages are the non-inverting input terminal with respect to the inverting input terminal. 3. VCC-Vin must not exceed 6 V, Vin must not exceed 6V. 4. Input current must be limited by a resistor in series with the inputs. 5. Short-circuits can cause excessive heating and destructive dissipation. 6. Rth are typical values. 7. Human body model: 100 pF discharged through a 1.5 k resistor between two pins of the device, done for all couples of pin combinations with other pins floating. 8. Machine model: a 200 pF cap is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5 ), done for all couples of pin combinations with other pins floating. 9. Charged device model: all pins plus package are charged together to the specified voltage and then discharged directly to the ground.
Table 2.
Symbol VCC Vicm Toper
Operating conditions
Parameter Supply voltage Common mode input voltage range Operating free air temperature range Value 1.5 to 5.5 VCC- - 0.1 to VCC+ + 0.1 -40 to +125 Unit V V C
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TSV63x
Electrical characteristics
3
Table 3.
Symbol
Electrical characteristics
Electrical characteristics at VCC+ = +1.8 V with VCC- = 0 V, Vicm = VCC/2, Tamb = 25 C, and RL connected to VCC/2 (unless otherwise specified)
Parameter Conditions Min. Typ. Max. Unit
DC performance TSV63x TSV63xA TSV633AIST - MiniSO10 Vio Offset voltage Tmin < Top < Tmax - TSV63x Tmin < Top < Tmax - TSV63xA Tmin < Top < Tmax - TSV633AIST Input offset voltage drift Input offset current (Vout = VCC/2) Input bias current (Vout = VCC/2) Common mode rejection ratio 20 log (Vic/Vio) Large signal voltage gain 2 1 Tmin < Top < Tmax 1 1 Tmin < Top < Tmax 0 V to 1.8 V, Vout = 0.9 V Tmin < Top < Tmax RL= 10 k Vout = 0.5 V to 1.3 V , Tmin < Top < Tmax High level output voltage Low level output voltage RL = 10 k Tmin < Top < Tmax RL = 10 k Tmin < Top < Tmax Vo = 1.8 V Tmin < Top < Tmax Vo = 0 V Tmin < Top < Tmax No load, Vout = VCC/2 Tmin < Top < Tmax 6 4 6 4 40 50 60 62 A A 10 mA 53 51 85 80 35 50 5 4 12 mA 35 50 95 1 74 10
(1)
3 0.8 1 4.5 2 2.2
mV
mV V/C pA pA pA pA dB dB dB dB mV mV
DVio Iio
100 10
(1)
Iib
100
CMR
Avd VOH VOL
Isink Iout Isource Supply current (per operator)
ICC
AC performance GBP m Gm SR en Gain bandwidth product Phase margin Gain margin Slew rate Equivalent input noise voltage RL = 2 k CL = 100 pF, f = 100 kHz , RL = 2 k, CL = 100 pF RL = 2 k, CL = 100 pF RL = 2 k, CL = 100 pF, Av = 1 f = 1 kHz f = 10 kHz 0.2 700 790 45 13 0.27 60 33 kHz Degrees dB V/s
nV ----------Hz
1. Guaranteed by design.
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Electrical characteristics Table 4.
Symbol DC performance SHDN = VCCICC Supply current in shutdown mode (all operators) Tmin < Top < 85 C Tmin < Top < 125 C ton toff VIH VIL IIH IIL IOLeak Amplifier turn-on time Amplifier turn-off time SHDN logic high SHDN logic low SHDN current high SHDN current low SHDN = VCC+ SHDN = VCC10 10 50 1 RL= 2 k , Vout = VCC- to VCC-+0.2 V RL = 2 k , Vout = VCC+ - 0.5 V to VCC+ - 0.7 V 1.35 0.6 200 20 2.5 50 200 1.5
TSV63x
Shutdown characteristics VCC = 1.8 V
Parameter Conditions Min. Typ. Max. Unit
nA nA A ns ns V V pA pA pA nA
Output leakage in shutdown SHDN = VCCmode Tmin < Top < 125 C
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TSV63x Table 5.
Symbol DC performance TSV63x TSV63xA TSV633AIST - MiniSO10 Vio Offset voltage Tmin < Top < Tmax - TSV63x Tmin < Top < Tmax - TSV63xA Tmin < Top < Tmax - TSV633AIST Input offset voltage drift Input offset current Tmin < Top < Tmax Input bias current Tmin < Top < Tmax Common mode rejection ratio 20 log (Vic/Vio) Large signal voltage gain 0 V to 3.3 V, Vout = 1.65 V Tmin < Top < Tmax RL = 10 k Vout = 0.5 V to 2.8 V , Tmin < Top < Tmax High level output voltage Low level output voltage RL = 10 k Tmi. < Top < Tmax RL = 10 k Tmin < Top < Tmax Vo = 3.3 V Tmin < Top < Tmax Vo = 0 V Tmin < Top < Tmax No load, Vout = 1.75 V Tmin < Top < Tmax 23 20 23 20 43 57 53 88 83 35 50
Electrical characteristics VCC+ = +3.3 V, VCC- = 0 V, Vicm = VCC/2, Tamb = 25 C, RL connected to VCC/2 (unless otherwise specified)
Parameter Conditions Min. Typ. Max. Unit
3 0.8 1 4.5 2 2.2 2 1 10(1) 100 10(1) 100
mV
mV V/C pA pA pA pA dB
DVio Iio
1 1
Iib
1 79
CMR
98 dB 5 4 45 mA 38 mA 55 64 66 A A 35 50
Avd VOH VOL
mV mV
Isink Iout Isource Supply current (per operator)
ICC
AC performance GBP m Gm SR Gain bandwidth product Phase margin Gain margin Slew rate RL = 2 k CL = 100 pF, , f = 100 kHz RL = 2 k, CL = 100 pF RL = 2 k, CL = 100 pF RL = 2 k CL = 100 pF, AV = 1 , 0.22 710 860 46 13 0.29 kHz Degrees dB V/s
1. Guaranteed by design.
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Electrical characteristics Table 6.
Symbol DC performance TSV63x TSV63xA TSV633AIST - MiniSO10 Vio Offset voltages Tmin < Top < Tmax - TSV63x Tmin < Top < Tmax - TSV63xA Tmin < Top < Tmax - TSV633AIST Input offset voltage drift Input offset current (Vout = VCC/2) Input bias current (Vout = VCC/2) Common mode rejection ratio 20 log (Vic/Vio) Supply voltage rejection ratio 20 log (VCC/Vio) Large signal voltage gain 2 1 Tmin < Top < Tmax 1 1 Tmin < Top < Tmax 0 V to 5 V, Vout = 2.5 V Tmin < Top < Tmax VCC = 1.8 to 5 V Tmin < Top < Tmax RL= 10 k Vout = 0.5 V to 4.5 V , Tmin < Top < Tmax VRF = 100 mVrms, f = 400 MHz EMIRR EMI Rejection Ratio VRF = 100 mVrms, f = 900 MHz
EMIRR = -20 log (VRFpeak/Vio) V = 100 mV RF rms, f =1800 MHz
TSV63x
Electrical characteristics at VCC+ = +5 V with VCC- = 0 V, Vicm = VCC/2, Tamb = 25 C, and RL connected to VCC/2 (unless otherwise specified)
Parameter Conditions Min. Typ. Max. Unit
3 0.8 1 4.5 2 2.2
mV
mV V/C
DVio Iio
10
(1)
pA pA pA pA dB dB
100 10(1) 100
Iib
1 60 55 75 73 89 84 61 85 98 102 80
CMR
SVR
dB dB dB
Avd
dB 92 83 35 50 7 6 40 35 40 35 50 60 69 72 A A 74 mA 69 mA 35 50 mV mV
VRF = 100 mVrms, f =2400 MHz VOH VOL High level output voltage Low level output voltage RL = 10 k Tmin < Top < Tmax RL = 10 k Tmin < Top < Tmax Vo = 5 V Tmin < Top < Tmax Vo = 0 V Tmin < Top < Tmax No load, Vout=VCC/2 Tmin < Top < Tmax
Isink Iout Isource Supply current (per operator)
ICC
AC performance GBP Fu Gain bandwidth product Unity gain frequency RL= 2 k CL = 100 pF, f = 100 kHz , RL = 2 k CL = 100 pF, , 730 880 830 kHz kHz
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TSV63x Table 6.
Symbol m Gm SR en THD+en
Electrical characteristics Electrical characteristics at VCC+ = +5 V with VCC- = 0 V, Vicm = VCC/2, Tamb = 25 C, and RL connected to VCC/2 (unless otherwise specified) (continued)
Parameter Phase margin Gain margin Slew rate Equivalent input noise voltage Total harmonic distortion + noise Conditions RL = 2 k, CL = 100 pF RL = 2 k, CL = 100 pF RL = 2 k, CL = 100 pF, Av=1 f = 1 kHz f = 10 kHz VCC = 5V, f = 1kHz, AV = 1, RL = 100k Vicm = VCC/2, Vout = 2VPP , 0.25 Min. Typ. 48 13 0.34 60 33 0.002 Max. Unit Degrees dB V/s
nV ----------Hz
%
1. Guaranteed by design.
Table 7.
Symbol
Shutdown characteristics at VCC = 5 V
Parameter Conditions Min. Typ. Max. Unit
DC performance SHDN = VCCICC Supply current in shutdown mode (all operators) Tmin < Top < 85 C Tmin < Top < 125 C ton toff VIH VIL IIH IIL IOLeak Amplifier turn-on time Amplifier turn-off time SHDN logic high SHDN logic low SHDN current high SHDN current low SHDN = VCC+ SHDN = VCC10 10 50 1 RL = 2 k , Vout = VCC- V to VCC-+0.2 V RL = 2 k , Vout = VCC+ - 0.5 V to VCC+ - 0.7 V 2 0.8 200 20 5 50 200 1.5 nA nA A ns ns V V pA pA pA nA
Output leakage in shutdown SHDN = VCCmode Tmin < Top < 125 C
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Electrical characteristics
TSV63x
Figure 2.
Supply current vs. supply voltage at Vicm = VCC/2
Figure 3.
Output current vs. output voltage at VCC = 1.5 V
Figure 4.
Output current vs. output voltage at Figure 5. VCC = 5 V
Voltage gain and phase vs. frequency at VCC = 1.5 V
Figure 6.
Voltage gain and phase vs. frequency at VCC = 5 V
Figure 7.
Phase margin vs. output current at VCC = 5 V
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TSV63x
Electrical characteristics
Figure 8.
Positive slew rate vs. time
Figure 9.
Negative slew rate vs. time
Figure 10. Positive slew rate vs. supply voltage
Figure 11. Negative slew rate vs. supply voltage
Figure 12. Distortion + noise vs. output voltage
Vcc=1.5V Rl=2k Vcc=1.5V Rl=100k
Figure 13. Distortion + noise vs. frequency
1 Vcc=1.5V Rl=2k
THD + N (%)
THD + N (%)
0.1 Vcc=1.5V Rl=100k
f=1kHz Gain=1 BW=22kHz Vicm=Vcc/2
Vcc=5.5V Rl=2k Vcc=5.5V Rl=100k Output Voltage (Vpp)
0.01
1E-3 10
100
1000
10000
100000
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Electrical characteristics
TSV63x
Figure 14. Noise vs. frequency
Equivalent Input Voltage Noise (nV/VHz)
Figure 15. EMIRR vs. frequency at Vcc = 5 V, T = 25 C
120
300 250 200 150 100 Vicm=4.5V 50 0
20 0 1 10
Vcc=5V Tamb=25 C
100
EMIRR Vpeak (dB)
Vicm=2.5V
80 60 40
100
1000
10000
10
2
10
3
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TSV63x
Application information
4
4.1
Application information
Operating voltages
The TSV63x can operate from 1.5 to 5.5 V. Their parameters are fully specified for 1.8-, 3.3and 5-V power supplies. However, the parameters are very stable in the full VCC range and several characterization curves show the TSV63x characteristics at 1.5 V. Additionally, the main specifications are guaranteed in extended temperature ranges from -40 C to +125 C.
4.2
Rail-to-rail input
The TSV63x are built with two complementary PMOS and NMOS input differential pairs. The devices have a rail-to-rail input, and the input common mode range is extended from VCC-- 0.1 V to VCC+ + 0.1 V. The transition between the two pairs appears at VCC+ - 0.7 V. In the transition region, the performance of CMRR, PSRR, Vio (Figure 16 and Figure 17) and THD is slightly degraded.
Figure 16. Input offset voltage vs input common mode at VCC = 1.5 V
Figure 17. Input offset voltage vs input common mode at VCC = 5 V
The devices are guaranteed without phase reversal.
4.3
Rail-to-rail output
The operational amplifiers' output levels can go close to the rails: 35 mV maximum above and below the rail when connected to a 10 k resistive load to VCC/2.
4.4
Shutdown function (TSV633 - TSV635)
The operational amplifiers are enabled when the SHDN pin is pulled high. To disable the amplifiers, the SHDN must be pulled down to VCC-. When in shutdown mode, the amplifiers' output is in a high impedance state. The SHDN pin must never be left floating, but tied to VCC+ or VCC-.
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Application information
TSV63x
The turn-on and turn-off times are calculated for an output variation of 200 mV (Figure 18 and Figure 19 show the test configurations). Figure 18. Test configuration for turn-on time (Vout pulled down) Figure 19. Test configuration for turn-off time (Vout pulled down)
+Vcc
GND
2KO
+Vcc
GND
2KO
Vcc = 5V T = 25C Vout Shutdown pulse
Vcc-0.5V
+ DUT GND
Vcc-0.5V
+ DUT GND
Figure 20. Turn-on time, VCC = 5 V, Vout pulled down, T = 25 C
Shutdown pulse
Figure 21. Turn-off time, VCC = 5 V, Vout pulled down, T = 25 C
Vout
Voltage (V)
Vcc = 5V T = 25 C RL connected to GND
Output voltage (V)
Time( s)
Time( s)
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TSV63x
Application information
4.5
Optimization of DC and AC parameters
These devices use an innovative approach to reduce the spread of the main DC and AC parameters. An internal adjustment achieves a very narrow spread of the current consumption (60 A typical, min/max at 17 %). Parameters linked to the current consumption value, such as GBP, SR and AVd, benefit from this narrow dispersion. All parts present a similar speed and the same behavior in terms of stability. In addition, the minimum values of GBP and SR are guaranteed (GBP = 730 kHz minimum and SR = 0.25 V/s minimum).
4.6
Driving resistive and capacitive loads
These products are micro-power, low-voltage operational amplifiers optimized to drive rather large resistive loads, above 2 k For lower resistive loads, the THD level may significantly . increase. In a follower configuration, these operational amplifiers can drive capacitive loads up to 100 pF with no oscillations. When driving larger capacitive loads, adding an in-series resistor at the output can improve the stability of the devices (see Figure 22 for recommended in-series resistor values). Once the in-series resistor value has been selected, the stability of the circuit should be tested on bench and simulated with the simulation model. Figure 22. In-series resistor vs. capacitive load
4.7
PCB layouts
For correct operation, it is advised to add 10 nF decoupling capacitors as close as possible to the power supply pins.
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Application information
TSV63x
4.8
Macromodel
Two accurate macromodels (with or without shutdown feature) of the TSV63x is available on STMicroelectronics' web site at www.st.com. This model is a trade-off between accuracy and complexity (that is, time simulation) of the TSV63x operational amplifiers. It emulates the nominal performances of a typical device within the specified operating conditions mentioned in the datasheet. It also helps to validate a design approach and to select the right operational amplifier, but it does not replace on-board measurements.
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TSV63x
Package information
5
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark.
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Package information
TSV63x
5.1
SOT23-8 package information
Figure 23. SOT23-8 package mechanical drawing
Table 8.
SOT23-8 package mechanical data
Dimensions
Ref. Min. A A1 A2 b c D E E1 e e1 L < 0.30 0 0.90 0.22 0.08 2.80 2.60 1.50
Millimeters Typ. Max. 1.45 0.15 1.30 0.38 0.22 3 3 1.75 0.65 1.95 0.60 8 0.012 0.035 0.009 0.003 0.110 0.102 0.059 Min.
Inches Typ. Max. 0.057 0.006 0.051 0.015 0.009 0.118 0.118 0.069 0.026 0.077 0.024
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TSV63x
Package information
5.2
SO-8 package information
Figure 24. SO-8 package mechanical drawing
Table 9.
SO-8 package mechanical data
Dimensions
Ref. Min. A A1 A2 b c D E E1 e h L L1 k ccc 0 0.25 0.40 0.10 1.25 0.28 0.17 4.80 5.80 3.80
Millimeters Typ. Max. 1.75 0.25 0.004 0.049 0.48 0.23 4.90 6.00 3.90 1.27 0.50 1.27 1.04 8 0.10 1 0.010 0.016 5.00 6.20 4.00 0.011 0.007 0.189 0.228 0.150 Min.
Inches Typ. Max. 0.069 0.010
0.019 0.010 0.193 0.236 0.154 0.050 0.020 0.050 0.040 8 0.004 0.197 0.244 0.157
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Package information
TSV63x
5.3
MiniSO-8 package information
Figure 25. MiniSO-8 package mechanical drawing
Table 10.
MiniSO-8 package mechanical data
Dimensions
Ref. Min. A A1 A2 b c D E E1 e L L1 L2 k ccc 0 0.40 0 0.75 0.22 0.08 2.80 4.65 2.80
Millimeters Typ. Max. 1.1 0.15 0.85 0.95 0.40 0.23 3.00 4.90 3.00 0.65 0.60 0.95 0.25 8 0.10 0 0.80 0.016 3.20 5.15 3.10 0 0.030 0.009 0.003 0.11 0.183 0.11 Min.
Inches Typ. Max. 0.043 0.006 0.033 0.037 0.016 0.009 0.118 0.193 0.118 0.026 0.024 0.037 0.010 8 0.004 0.031 0.126 0.203 0.122
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TSV63x
Package information
5.4
MiniSO-10 package information
Figure 26. MiniSO-10 package mechanical drawing
Table 11.
MiniSO-10 package mechanical data
Dimensions
Ref. Min. A A1 A2 b c D E E1 e L L1 k aaa 0 0.40 0.05 0.78 0.25 0.15 2.90 4.75 2.90
Millimeters Typ. Max. 1.10 0.10 0.86 0.33 0.23 3.00 4.90 3.00 0.50 0.55 0.95 3 6 0.10 0 0.70 0.016 0.15 0.94 0.40 0.30 3.10 5.05 3.10 0.002 0.031 0.010 0.006 0.114 0.187 0.114 Min.
Inches Typ. Max. 0.043 0.004 0.034 0.013 0.009 0.118 0.193 0.118 0.020 0.022 0.037 3 6 0.004 0.028 0.006 0.037 0.016 0.012 0.122 0.199 0.122
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Package information
TSV63x
5.5
TSSOP14 package information
Figure 27. TSSOP14 package mechanical drawing
Table 12.
TSSOP14 package mechanical data
Dimensions
Ref. Min. A A1 A2 b c D E E1 e L L1 k aaa 0 0.45 0.05 0.80 0.19 0.09 4.90 6.20 4.30
Millimeters Typ. Max. 1.20 0.15 1.00 1.05 0.30 0.20 5.00 6.40 4.40 0.65 0.60 1.00 8 0.10 0 0.75 0.018 5.10 6.60 4.50 0.002 0.031 0.007 0.004 0.193 0.244 0.169 Min.
Inches Typ. Max. 0.047 0.004 0.039 0.006 0.041 0.012 0.0089 0.197 0.252 0.173 0.0256 0.024 0.039 8 0.004 0.030 0.201 0.260 0.176
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TSV63x
Package information
5.6
TSSOP16 package information
Figure 28. TSSOP16 package mechanical drawing
Table 13.
b
TSSOP16 package mechanical data
Dimensions
Ref. Min. A A1 A2 b c D E E1 e k L L1 aaa 0 0.45 0.05 0.80 0.19 0.09 4.90 6.20 4.30
Millimeters Typ. Max. 1.20 0.15 1.00 1.05 0.30 0.20 5.00 6.40 4.40 0.65 8 0.60 1.00 0.10 0.75 0 0.018 5.10 6.60 4.50 0.002 0.031 0.007 0.004 0.193 0.244 0.169 Min.
Inches Typ. Max. 0.047 0.006 0.039 0.041 0.012 0.008 0.197 0.252 0.173 0.0256 8 0.024 0.039 0.004 0.030 0.201 0.260 0.177
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Ordering information
TSV63x
6
Ordering information
Table 14. Order codes
Temperature range Package Packing Marking TSV632 SO-8 TSV632AID/DT TSV632IST MiniSO-8 TSV632AIST TSV632ILT TSV633IST TSV633AIST TSV634IPT TSSOP-14 TSV634AIPT TSV635IPT TSSOP-16 TSV635AIPT Tape & reel TSV635A Tape & reel TSV634A TSV635 -40 C to +125 C MiniSO-10 Tape & reel K146 TSV634 SOT23-8 Tape & reel Tape & reel K145 K110 K111 Tube and tape & reel TV632A K110
Order code TSV632ID/DT
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Doc ID 15688 Rev 2
TSV63x
Revision history
7
Revision history
Table 15.
Date 25-May-2009 15-Jun-2009
Document revision history
Revision 1 2 Initial release. Corrected pin connection diagram in Figure 1. Changes
Doc ID 15688 Rev 2
25/26
TSV63x
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Doc ID 15688 Rev 2

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